Image: Sony Semiconductor Solutions Corporation 
Image: Sony Semiconductor Solutions Corporation 
Image: Sony Semiconductor Solutions Corporation 
Image: Sony Semiconductor Solutions Corporation
Optimized for Edge Systems
When image data is processed by AI or machines, an effective method to shorten the inspection time and improve the data processing efficiency is to cut out just the areas necessary, to narrow down the information and reduce the processing time. Our image sensors are equipped with an ROI function to identify just the areas necessary, and a self-trigger function to output just the data from the instant necessary. The stacked structure has also enabled the inclusion of two AD converters and the sensors are equipped with a function to internally combine data with different gain. The HDR processing that is normally achieved by overlaying multiple images can be processed without the occurrence of artifacts. In addition, completing the combination inside the sensor means that the volume of data output remains the same as on the conventional models, realizing a highly robust sensor. This kind of functional expansion is realized by stacking technology. As shown in Image 5, the key point for stacking technology is that the wafer processing for the pixel section can be separate from that for the circuit section, so it is possible to have image quality improvement and function expansion scalability.
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